Orange, 4.1 mil (0.10 mm) polyester film tape with silicone/rubber blend adhesive. Used for masking many printed wiring boards during the gold tip plating process.
Red, 3.0 mil (0.08 mm) polyester film tape with silicone/rubber blend adhesive. Used for printed circuitry masking during electroplating of solder mask over bare copper (SMOBC) printed circuit boards.
Green, 4.0 mil (0.10 mm) polyester film tape with silicone/rubber adhesive blend. A polyester film tape with a unique conformable adhesive for printed circuit board masking during electroplating.
Amber, 2.7 mil (0.07 mm) polyimide film tape with silicone adhesive. Unique and extremely low electrostatic discharge properties. Mask for many printed circuit boards during wave solder or solder dip process.
Gold, 2.7 mil (0.07 mm) polyimide film tape with silicone adheisve. Unique and extremely low electrostatic discharge properties. Used for gold tab protection during wave soldering of printed circuit boards.
Amber, 2.7 mil (0.07 mm) polyimide film tape with silicone adhesive. Designed for high temperature applications such as wave soldering and protection for bar code labels which are subjected to high temperature.
Transparent, 2.5 mil (0.06 mm) polyvinyl alcohol film tape with synthetic adhesive. Used to mask gold fingers on printed circuit boards during wave soldering.
Format d'imprimante convivial