250-350F (121-177C) curing, low-density, expandable product designed for the purpose of filling mismatched areas and for splicing and reinforcing honeycomb core. High performance over the -67F to 250F (-55C to 12C) temperature range when cured at 250F. High performance over a -67F to 350F (-55C to 177C) temperature range when cured at 350F (177C).

250F (121C) to 350F (176C) curing, low-density, expandable core splice adhesive film. High expansion (250%). Low sag during cure. Low volatile loss. High performance from -67°F to 350°F (-55°C to 176°C).

250F to 350F (121C to 176C) curing, low-density, expandable core splice adhesive film. Expands during cure for void filling and core splicing. Low sag during cure. Low volatile loss during cure. High performance from -67F to 350F (-55C to 176C).

Designed for interior edge finishing and core splicing of sandwich panels. Full stand lone FST properties, meets FAR 25.853 or ABD 0031. Dual curing system (250 F to 350 F). Low expansion. Low density. Halogen-free FST system.

Designed for exterior edge finishing. Combination of toughness and flexibility. Dual curing system (250 F to 350 F). First foaming material with good impact resistance.