250F (121C) to 350F (176C) curing, low-density, expandable core splice adhesive film. High expansion (250%). Low sag during cure. Low volatile loss. High performance from -67°F to 350°F (-55°C to 176°C).
Low Density Film for Filling Mismatch Areas, Splicing and Reinforcing Honeycomb Core. High Expansion, Low Sag, Low Volatile Loss. High Performance at Temperatures from Minus 67 to 350 Degrees F. Use with Scotch-Weld ™ Bonding Films.
3M™ Scotch-Weld™ Structural Core Splice Adhesive AF 3024 is a 250°F (121°C) to 350°F (176°C) curing, low density, expandable core splice adhesive film.
3M™ Scotch-Weld™ Structural Core Splice Adhesive AF 3024 is a 250 F to 350 F (121 C to 176 C) curing, low density, expandable core splice adhesive film. It is designed for filling mismatch areas or reinforcing and splicing honeycomb core.
3M™ Scotch-Weld™ Structural Core Splice Adhesive AF 3024 is a 250°F (121°C) to 350°F (176°C) curing, low density, expandable core splice adhesive film.
3M™ Scotch-Weld™ Structural Core Splice Adhesive AF 3024 is a 250°F (121°C) to 350°F (176°C) curing, low density, expandable core splice adhesive film.
Low Density Film for Filling Mismatch Areas, Splicing and Reinforcing Honeycomb Core. High Expansion, Low Sag, Low Volatile Loss. High Performance at Temperatures from Minus 67 to 350 Degrees F. Use with Scotch-Weld ™ Bonding Films.
3M™ Scotch-Weld™ Structural Core Splice Adhesive AF 3024 is a 250°F (121°C) to 350°F (176°C) curing, low density, expandable core splice adhesive film.
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