Thin polyimide film with silicone adhesive is dimensionally stable at high temperatures, making it an excellent choice for high temperature masking and as a release surface for parts cured at elevated temperatures.
Amber, 2.7 mil (0.07 mm) polyimide film tape with silicone adhesive. Unique and extremely low electrostatic discharge properties. Mask for many printed circuit boards during wave solder or solder dip process.
Gold, 2.7 mil (0.07 mm) polyimide film tape with silicone adheisve. Unique and extremely low electrostatic discharge properties. Used for gold tab protection during wave soldering of printed circuit boards.
Amber, 2.7 mil (0.07 mm) polyimide film tape with silicone adhesive. Designed for high temperature applications such as wave soldering and protection for bar code labels which are subjected to high temperature.
Transparent, 2.5 mil (0.06 mm) polyvinyl alcohol film tape with synthetic adhesive. Used to mask gold fingers on printed circuit boards during wave soldering.
Printer-friendly format