Select a Location Alaska Argentina Australia Austria Bahrain Belgium Bolivia Brasil Canada Chile China Columbia Costa Rica Czech Republic Denmark Dominican Republic Ecuador Egypt El Salvador Finland France Germany Greece Guam Guatemala Hawaii Honduras Hong Kong Hungary India Indonesia Ireland Israel Italy Jamaica Japan Kazakhstan Kenya Korea Kuwait Lebanon Malaysia Mexico Morocco Netherlands New Zealand Nicaragua Norway Oman Pakistan Panama Paraguay Peru Philippines Poland Portugal Puerto Rico Qatar Romania Russia Saudi Arabia Singapore Slovakia Slovenia South Africa Spain Sri Lanka Sweden Switzerland Syria Taiwan Thailand Trinidad Turkey UAE Ukraine United Kingdom United States Uruguay Venezuela Vietnam Yemen Yugoslavia Zimbabwe     English

Solutions for Microelectronic Packaging Flexible Circuits Multilayer Packaging Applications Capabilities Technologies Materials Manufacturing Locations News & Events Six Sigma Site Map Technical Library Technical Papers Industry Links Contact Information Guestbook Submit an RFQ Request a Sample Contact Us

Microelectronic Packaging 3M™ Multilayer Packaging  Printer-friendly format 3M™ Multilayer Packaging Applications: Flip Chip [click to enlarge] 3M multilayer flip chip substrates offer high density, performance, and reliability for peripheral and area array designs. Direct chip to heat spreader interface allows for efficient removal of heat from the IC. Additional Information Learn More . . .   3M™ High Performance Family of Organic Flip Chip Substrates - Bulletin (PDF 86.9 K)   Composite Organic Dielectric paper - Article Reprint (PDF 249.2 K)   Design and Characterization of a 10 GHz Organic BGA Package - Article Reprint (PDF 434.1 K)   Simultaneous Switching Noise paper - Article Reprint (PDF 383.1 K)   Thermal Cycling Effects Paper - Article Reprint (PDF 2.6 MB)   VCP Package Stripline Two Port - Article Reprint (PDF 407.3 K) Please Note: Adobe® Acrobat® Reader is required to view PDF documents.

	©3M 1995-2006 Legal Information Privacy Policy