Looking to 3M™ for more complete solutions to your PCB fabricationneeds. We offer physical design, modeling, advanced materials options, signal integrity analysis, electrical testing, field reliability simulation and analysis, and after-sales support.

Interconnect boards are available today from 3M™ for full wafer level burn-in and test (WLBI/T). 3M™ manufactures these boards using production technology that matches the thermal expansion coefficient of silicon wafers. The boards have extremely tight tolerances for flatness, and feature placement accuracy with superior electrical performance.

3M multilayer flip chip substrates offer high density, performance, and reliability for peripheral and area array designs. Direct chip to heat spreader interface allows for efficient removal of heat from the IC.

3M multilayer wire bond substrates offer high performance, wire bond density, and reliability. Direct die attach to heat spreader interface allows for efficient removal of heat from the IC.