Improve the consistency of your semiconductor CMP process. Long lasting 3M™ Diamond Pad Conditioners properly prepare the surface of the CMP pad, lengthening the life of the pad and enabling more consistent wafer removal rates.
New 3M technology allows for the controlled placement and spacing of diamond in a metal bond matrix. Premium graded diamond is combined with a tightly controlled mfg. process to produce consistent single layer diamond disks for CMP pad conditioning.
New 3M technology allows for the controlled placement and spacing of diamond in a metal bond matrix. Premium graded diamond is combined with a tightly controlled mfg. process to produce consistent single layer diamond rings for CMP pad conditioning.
