Meet the most demanding finish requirements with 3M's most highly engineered abrasive products. Improve planarization in your semiconductor CMP operation. Better diamond rentention in semiconductor pad conditioning. Improved probe tip cleaning.
Improve the consistency of your semiconductor CMP process. Long lasting 3M™ Diamond Pad Conditioners properly prepare the surface of the CMP pad, lengthening the life of the pad and enabling more consistent wafer removal rates.
3M's innovative structured abrasive CMP product offers superior planarization and eliminates traditional slurries and pads in the chemical mechanical planarization of semiconductor wafers.
