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Abrasive Finishing Solutions
Product Catalog for 3M™ Superbrasives and Microabrasives Solutions
Abrasive Industrial Applications
Abrasive Opto-Electronic Applications
Abrasive Semiconductor Applications
Product Catalog for 3M™ Superbrasives and Microabrasives Solutions
Abrasive Semiconductor Applications
Semiconductor CMP - Pad Conditioning
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3M™ Diamond Pad Conditioning Rings
[click to enlarge]
New 3M technology allows for the controlled placement and spacing of diamond in a metal bond matrix. Premium graded diamond is combined with a tightly controlled mfg. process to produce consistent single layer diamond rings for CMP pad conditioning.
Additional Information
Learn More . . .
3M™ Diamond Pad Conditioners for CMP, flyer - Flyer (PDF 416.6 K)
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