Sintered metal bond products utilize 3M's patented process that allows for the controlled placement, spacing, and distribution of diamond in a durable, wear resistant metal bond.
New 3M technology allows for the controlled placement and spacing of diamond in a metal bond matrix. Premium graded diamond is combined with a tightly controlled mfg. process to produce consistent single layer diamond disks for CMP pad conditioning.
New 3M technology allows for the controlled placement and spacing of diamond in a metal bond matrix. Premium graded diamond is combined with a tightly controlled mfg. process to produce consistent single layer diamond rings for CMP pad conditioning.
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