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Abrasive Finishing Solutions
Product Catalog for 3M™ Superbrasives and Microabrasives Solutions
Abrasive Industrial Applications
Abrasive Opto-Electronic Applications
Abrasive Semiconductor Applications
Product Catalog for 3M™ Superbrasives and Microabrasives Solutions
Abrasive Semiconductor Applications
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Semiconductor CMP - Wafer Planarization
[click to enlarge]
3M's innovative structured abrasive CMP product offers superior planarization and eliminates traditional slurries and pads in the chemical mechanical planarization of semiconductor wafers.
Additional Information
Learn More . . .
Fixed Abrasives and Selective Chemistries PDF - Article Reprint (PDF 289.0 K)
SlurryFree™ CMP Technical Brief PDF - Technical Paper (PDF 339.2 K)
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3M™ SlurryFree™ CMP Fixed Abrasive Oxide Rolls
High performance, ceria based fixed abrasive CMP consumable.
3M™ SlurryFree™ CMP Fixed Abrasive P6900 Sub Pads
Composite subpad for use with 3M™ SlurryFree™ CMP rolls. Specific constructions and sizes for use on web-based CMP tools.
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