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Product Catalog for 3M™ Superbrasives and Microabrasives Solutions Abrasive Semiconductor Applications

 Printer-friendly format Semiconductor CMP - Wafer Planarization
3M™ SlurryFree™ CMP [click to enlarge]
3M's innovative structured abrasive CMP product offers superior planarization and eliminates traditional slurries and pads in the chemical mechanical planarization of semiconductor wafers.

Additional Information

Learn More . . .

  Fixed Abrasives and Selective Chemistries PDF - Article Reprint (PDF 289.0 K)
  SlurryFree™ CMP Technical Brief PDF - Technical Paper (PDF 339.2 K)

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3M™ SlurryFree™ CMP Fixed Abrasive Oxide Rolls
High performance, ceria based fixed abrasive CMP consumable.

3M™ SlurryFree™ CMP Fixed Abrasive P6900 Sub Pads
Composite subpad for use with 3M™ SlurryFree™ CMP rolls. Specific constructions and sizes for use on web-based CMP tools.


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