3M™ Glass Bubbles S32 have a density of 0.32 g/cc and an isostatic crush strength of 2000 psi. The S Series glass bubbles have smaller particle sizes than the K Series.
Application Guide
Listed below are key applications for S32 glass bubbles. Documents specific to the application are listed to the right.
Industrial Explosives
Small particle size, low density and extreme high strength make 3M Glass Bubbles S32 ideal sensitizers for high performance explosives like packaged emulsions, water gels and slurries.
Provide outstanding velocity of detonation (VOD); high fragmentation
Inert, non-coalescing particles provide consistent performance over time
True density: 0.32 g/cc
Target crush strength (90% survival): 2000 psi
Paints and Coatings
3M glass bubbles offer a variety of benefits to light weight, high-build elastomeric roof coatings, anti-condensation coatings, etc. Here are some of the benefits:
Lower viscosity, improved flow
Increased filler loading, reduced cost
VOC reduction
Chemical stability and inertness
Reduced dielectric constant
Thermal conductivity reduction
Temperature resistance
Thermal Insulating Additives
The thermal conductivity of 3M S32 glass bubbles is approximately 0.10
W·m-1·K-1
at 70°F (21°C). This low thermal conductivity contribution to syntactic foam pipe coatings makes S32
glass bubbles an ideal additive in insulation coatings for pipelines and production risers. The 2000 psi test
strength of S32 glass bubbles means they can survive both the rigorous demands of processing and the enormous
water pressure at depths up to about 4500 feet (1370 meters) of seawater.
Like all 3M glass bubbles, they are virtually insoluble in water or oil.
Additional Information
The thermal conductivity of 3M S32 glass bubbles is approximately 0.10 W•m-1•K-1 at 70°F (21°C). This low thermal conductivity contribution to syntactic foam pipe coatings makes S32 glass bubbles an ideal additive in insulation coatings for pipelines and production risers. The 2000 psi test strength of S32 glass bubbles means they can survive both the rigorous demands of processing and the
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